EXSHINE Part Number: | EX-0C98055902 |
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Manufacturer Part Number: | 0C98055902 |
Manufacturer / Brand: | Laird Technologies - EMI |
Brief Description: | RFI EMI GROUNDING MATERIAL 25FT |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | Low Profile Gasket Catalog |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Width | 0.300" (7.62mm) |
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Type | Fingerstock |
Shape | - |
Series | Twist |
Plating - Thickness | - |
Plating | Unplated |
Other Names | 903-1238 |
Operating Temperature | 121°C |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Beryllium Copper |
Manufacturer Standard Lead Time | 4 Weeks |
Manufacturer Part Number | 0C98055902 |
Length | 24.000" (609.60mm) |
Height | 0.070" (1.78mm) |
Description | RFI EMI GROUNDING MATERIAL 25FT |
Attachment Method | Adhesive |
Standard Package | 25 |
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Other Names | 903-1238 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
Laird Technologies is an industry-leading EMI solutions provider, supplying innovative design through the manufacture of customized, performance-critical products in every available material and form factor. Products include board-level shields, combination shields, ferrite shields, EMI gaskets, vent panels and shielded windows, finger gaskets, and conductive elastomers, as well as Fabric-Over-Foam gaskets, Form-In-Place gaskets, and conductive foam and fabric. Laird Technologies constantly invents and perfects new materials, processes, and products to solve EMI problems. Customized product solutions are designed for customers in all markets of the electronics and wireless industries including the computing, telecommunications, data transfer and information technology, automotive, consumer, aerospace, defense, medical, and industrial markets.