IPL1-120-02-L-D-K

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IPL1-120-02-L-D-K

EXSHINE Part Number:EX-IPL1-120-02-L-D-K
Manufacturer Part Number:IPL1-120-02-L-D-K
Manufacturer / Brand:Samtec, Inc.
Brief Description:.100 TERMINAL ASSEMBLY
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:IPL1 Series DatasheetIPL1-1x-x-x-D-x Drawing
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
IPL1-120-02-L-D-K
In stock: 16720 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order IPL1-120-02-L-D-K online

US$ 6.62

Reference Marketing Price: US$ 6.62

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  • Description
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Product Parameter

Voltage Rating 675VAC, 954VDC
Termination Solder
Style Board to Cable/Wire
Shrouding Shrouded - 4 Wall
Series Mini Mate® IPL1
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Tube
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 40
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number IPL1-120-02-L-D-K
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.320" (8.13mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Locking Ramp
Expanded Description 40 Positions Header Connector Surface Mount
Description .100 TERMINAL ASSEMBLY
Current Rating -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.215" (5.46mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Standard Package 1

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Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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