SSW-137-01-T-S

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SSW-137-01-T-S

EXSHINE Part Number:EX-SSW-137-01-T-S
Manufacturer Part Number:SSW-137-01-T-S
Manufacturer / Brand:Samtec, Inc.
Brief Description:CONN RCPT .100" 37POS SNGL TIN
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:SSW Drawing - Thru HoleSSW, SSQ Datasheet - Thru HoleSSW Single Row Footprint
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SSW-137-01-T-S
In stock: 53610 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order SSW-137-01-T-S online

US$ 3.41

Reference Marketing Price: US$ 3.41

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$3.41
10+:
$3.054
100+:
$2.515
500+:
$1.988
1000+:
$1.707
5000+:
$1.557
10000+:
$1.497
  • Description
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  • Packaging

Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board or Cable
Series SSW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names SAM1213-37
Operating Temperature -55°C ~ 105°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 37
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Part Number SSW-137-01-T-S
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.335" (8.51mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Expanded Description 37 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin
Description CONN RCPT .100" 37POS SNGL TIN
Current Rating 5.7A per Contact
Contact Type Forked
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.104" (2.65mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Receptacle
Applications -

Others

Standard Package 1
Other Names SAM1213-37

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Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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