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100-016-001

EXSHINE Part Number:EX-100-016-001
Manufacturer Part Number:100-016-001
Manufacturer / Brand:3M
Brief Description:CONN IC DIP SOCKET 16POS GOLD
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:1x0-0xx-05y
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
100-016-001
In stock: 87466 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Type DIP, 0.3" (7.62mm) Row Spacing
Termination Post Length 0.126" (3.20mm)
Termination Solder
Series 100
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names 05111165335
JE150135919
Operating Temperature -65°C ~ 125°C
Number of Positions or Pins (Grid) 16 (2 x 8)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Part Number 100-016-001
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Features Closed Frame, Seal Tape
Description CONN IC DIP SOCKET 16POS GOLD
Current Rating 1A
Contact Resistance -
Contact Material - Post Brass
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post Flash
Contact Finish Thickness - Mating 8µin (0.20µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold

Others

Standard Package 200
Other Names 05111165335

JE150135919

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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