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3428-5502

EXSHINE Part Number:EX-3428-5502
Manufacturer Part Number:3428-5502
Manufacturer / Brand:3M
Brief Description:CONN HEADER 20PS R/A SHORT LATCH
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:3000 Series, Four-Wall Header DatasheetShort Form Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
3428-5502
In stock: 22362 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Shrouded - 4 Wall
Series 3000
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Overall Contact Length -
Other Names 05113861628
80610469423
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 20
Mounting Type Through Hole, Right Angle
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Part Number 3428-5502
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Insulation Height 0.340" (8.64mm)
Insulation Color Black
Ingress Protection -
Features Keying Slot, Mounting Flange
Fastening Type Latch Lock/Eject Hooks, Short
Expanded Description 20 Positions Header Connector 0.100" (2.54mm) Through Hole, Right Angle Gold
Description CONN HEADER 20PS R/A SHORT LATCH
Current Rating 1.75A
Contact Type Male Pin
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post 0.112" (2.84mm)
Contact Length - Mating 0.240" (6.10mm)
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Tin-Lead
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Standard Package 100
Other Names 05113861628

80610469423

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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