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FP-301-1/8-CLEAR-6

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FP-301-1/8-CLEAR-6"-PACK

EXSHINE Part Number:EX-FP-301-1/8-CLEAR-6"-PACK
Manufacturer Part Number:FP-301-1/8-CLEAR-6"-PACK
Manufacturer / Brand:3M
Brief Description:HEATSHRINK FP301 1/8-6" CLEAR
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Heat Shrink Tubing and Devices CatalogHeat Shrink Tubing Selection GuideHeat Shrink Product CatalogFP-301 Series Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
FP-301-1/8-CLEAR-6"-PACK
In stock: 29490 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order FP-301-1/8-CLEAR-6"-PACK online

US$ 13.7

Reference Marketing Price: US$ 13.7

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

10+:
$13.70
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Product Parameter

Values 10 - 34 pc Pkgs - 6" (152.4mm) lengths
Shrinkage Ratio 2 to 1
Series FP-301
Packaging Refill Pack
Other Names 00051135364918
05113536491
80610783989
FP301-1/8-CLEAR-6"-PACK
Manufacturer Part Number FP-301-1/8-CLEAR-6"-PACK
Expanded Description Heat Shrink Kit 10 - 34 pc Pkgs - 6" (152.4mm) lengths 2 to 1 Clear
Diameter 1/8"
Description HEATSHRINK FP301 1/8-6" CLEAR
Color Clear

Others

Other Names 00051135364918

05113536491

80610783989

FP301-1/8-CLEAR-6"-PACK
Standard Package 10

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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