H-33-BIN

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H-33-BIN

EXSHINE Part Number:EX-H-33-BIN
Manufacturer Part Number:H-33-BIN
Manufacturer / Brand:3M
Brief Description:CONN WIRE NUT 14-22 AWG TWIST ON
Lead Free Status / RoHS Status:Not applicable / Not applicable
Condition:New and unused, Original
Datasheet Download:H-33-BIN
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
H-33-BIN
In stock: 22832000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order H-33-BIN online

US$ 0.1

Reference Marketing Price: US$ 0.1

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Minimum:1

Multiples:1

1000+:
$0.10
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Product Parameter

Wire Gauge 14-22 AWG
Termination Twist On
Terminal Type Wire Nut
Series Highland™
Packaging Bulk
Other Names 00054007431374
05400743137
80610981260
Number of Wire Entries Varies by Wire Size
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number H-33-BIN
Insulation Fully Insulated
Features Copper Wire Only
Expanded Description Terminal Wire Nut Connector Twist On 14-22 AWG Yellow
Description CONN WIRE NUT 14-22 AWG TWIST ON
Color Yellow

Others

Other Names 00054007431374

05400743137

80610981260
Standard Package 1,000

You can choose the below payment options. Please contact our sales team if you have any questions.

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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 1-3 days.
 FEDEX EXPRESS
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 UPS EXPRESS
 Delivery time: 2-4 days.
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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