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MP2-H030-54P1-S-FJ

EXSHINE Part Number:EX-MP2-H030-54P1-S-FJ
Manufacturer Part Number:MP2-H030-54P1-S-FJ
Manufacturer / Brand:3M
Brief Description:CONN HEADER VERT 30POS 5ROW GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:MetPak™ MP2 Series SpecMP2 Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
MP2-H030-54P1-S-FJ
In stock: 10800 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order MP2-H030-54P1-S-FJ online

US$ 2.201

Reference Marketing Price: US$ 2.201

Our Best Price: N/A (Email us)

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Multiples:1

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$2.201
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Product Parameter

Voltage Rating -
Termination Press-Fit
Series MetPak™ MP2
Pitch 0.079" (2.00mm)
Packaging Bulk
Other Names 00051119914986
05111991498
5111991498
51119914986
70010014622
Operating Temperature -55°C ~ 125°C
Number of Rows 5
Number of Positions Loaded All
Number of Positions 30
Number of Columns -
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 7 Weeks
Manufacturer Part Number MP2-H030-54P1-S-FJ
Features Board Guide
Description CONN HEADER VERT 30POS 5ROW GOLD
Current Rating 1.5A
Contact Layout, Typical -
Contact Finish Thickness 10µin (0.25µm)
Contact Finish Gold
Connector Usage Backplane
Connector Type Header, Male Pins
Connector Style Futurebus+®
Color Beige

Others

Other Names 00051119914986

05111991498

5111991498

51119914986

70010014622
Standard Package 840

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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