0876090051

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EXSHINE Part Number:	EX-0876090051
Manufacturer Part Number:	0876090051
Manufacturer / Brand:	Affinity Medical Technologies - a Molex company
Brief Description:	CONN SKT DIMM 168POS R/A PCB
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	876090051
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

0876090051
In stock: 62899 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Packaging

Product Parameter

Standards	MO-161
Series	87609
Packaging	Tray
Other Names	087609-0051 87609-0051 876090051
Number of Positions	168
Mounting Type	Through Hole, Right Angle
Mounting Feature	Normal, Standard - Top
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Memory Type	DDR SDRAM
Manufacturer Part Number	0876090051
Features	Board Guide, Board Lock, Latches
Expanded Description	168 Position DIMM DDR SDRAM Socket Through Hole, Right Angle
Description	CONN SKT DIMM 168POS R/A PCB
Contact Finish Thickness	15µin (0.38µm)
Contact Finish	Gold
Connector Style	DIMM

Others

Other Names	087609-0051 87609-0051 876090051
Standard Package	10

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	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
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	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Molex, LLC

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling.
Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity.
For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.

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