FT221XQ-T

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FT221XQ-T

EXSHINE Part Number:EX-FT221XQ-T
Manufacturer Part Number:FT221XQ-T
Manufacturer / Brand:FTDI (Future Technology Devices International, Ltd.)
Brief Description:IC USB 8 BIT SPI/FT1248 20QFN
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:FT221X
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
FT221XQ-T
In stock: 78230 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 2.12

Reference Marketing Price: US$ 2.12

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$2.12
  • Description
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  • Packaging

Product Parameter

Voltage - Supply 3.3 V ~ 5 V
Supplier Device Package 20-QFN (4x4)
Series USBmadeEZ-FIFO, FT-X, X-Chip
Packaging Tray
Package / Case 20-WFQFN Exposed Pad
Other Names 768-1151
FT221XQT
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Manufacturer Standard Lead Time 12 Weeks
Manufacturer Part Number FT221XQ-T
Interface USB, SPI, Sync Parallel
Expanded Description Interface 20-QFN (4x4)
Description IC USB 8 BIT SPI/FT1248 20QFN
Applications -

Others

Other Names 768-1151

FT221XQT
Standard Package 490

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Distributor of FTDI, Future Technology Devices International Ltd

- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.

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