TTL-234X-3V3

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TTL-234X-3V3

EXSHINE Part Number:EX-TTL-234X-3V3
Manufacturer Part Number:TTL-234X-3V3
Manufacturer / Brand:FTDI (Future Technology Devices International, Ltd.)
Brief Description:CABLE USB TO UART 3.3V .1" CONN
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:TTL234X Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
TTL-234X-3V3
In stock: 98790 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order TTL-234X-3V3 online

US$ 26.64

Reference Marketing Price: US$ 26.64

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$26.64
10+:
$24.048
25+:
$23.04
50+:
$21.60
100+:
$20.88
250+:
$19.728
500+:
$19.152
  • Description
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Product Parameter

Series *
Other Names 768-1319
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 12 Weeks
Manufacturer Part Number TTL-234X-3V3
Expanded Description Cable
Description CABLE USB TO UART 3.3V .1" CONN

Others

Standard Package 1
Other Names 768-1319

You can choose the below payment options. Please contact our sales team if you have any questions.

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Distributor of FTDI, Future Technology Devices International Ltd

- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.

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