UMFT602A

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UMFT602A

EXSHINE Part Number:EX-UMFT602A
Manufacturer Part Number:UMFT602A
Manufacturer / Brand:FTDI (Future Technology Devices International, Ltd.)
Brief Description:DEV BOARD FT602 USB3 32BIT HSMC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:FT602QUMFT602A,X
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
UMFT602A
In stock: 29540 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 66.93

Reference Marketing Price: US$ 66.93

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$66.93
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Product Parameter

Utilized IC / Part FT602
Supplied Contents Board
Series -
Secondary Attributes LED Status Indicators
Primary Attributes -
Other Names 768-1314
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 12 Weeks
Manufacturer Part Number UMFT602A
Main Purpose Interface, USB 3.0 to Parallel FIFO Bridge
Expanded Description FT602 - Interface, USB 3.0 to Parallel FIFO Bridge Evaluation Board
Embedded -
Description DEV BOARD FT602 USB3 32BIT HSMC

Others

Standard Package 1
Other Names 768-1314

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Distributor of FTDI, Future Technology Devices International Ltd

- FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity.
FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China). For more information go to www.ftdichip.com.

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