732977

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732977

EXSHINE Part Number:EX-732977
Manufacturer Part Number:732977
Manufacturer / Brand:Henkel/Loctite
Brief Description:97SC HYDRO-X 2% .064DIA/16SWG
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Hydro-XCored Wire Storage GuidelinesProperties of Solders
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
732977
In stock: 23570 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 732977 online

US$ 75.58

Reference Marketing Price: US$ 75.58

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$75.58
5+:
$67.544
10+:
$54.678
25+:
$51.462
50+:
$48.245
100+:
$45.029
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Wire Gauge 14 AWG, 16 SWG
Weight 1 lb (453.59g)
Type Wire Solder
Shipping Info -
Shelf Life No Shelf Life
Series Hydro-X
Process Lead Free
Other Names 82-135
MM01947
Melting Point 423 ~ 428°F (217 ~ 220°C)
Manufacturer Standard Lead Time 11 Weeks
Manufacturer Part Number 732977
Form Spool, 454g (1 lb)
Flux Type Water Soluble
Expanded Description Lead Free Water Soluble Wire Solder Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 14 AWG, 16 SWG Spool, 454g (1 lb)
Diameter 0.064" (1.63mm)
Description 97SC HYDRO-X 2% .064DIA/16SWG
Core Size 0.022
Composition Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)

Others

Other Names 82-135

MM01947
Standard Package 20

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Distributor of Multicore

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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