SPT400-12-11-25

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SPT400-12-11-25

EXSHINE Part Number:EX-SPT400-12-11-25
Manufacturer Part Number:SPT400-12-11-25
Manufacturer / Brand:Henkel/Loctite
Brief Description:THERM PAD TO-220 TUBE 11X25MM
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:SPT400, SPT1000 Sil-Pad TubesThermal Clad Selection Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SPT400-12-11-25
In stock: 70610000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order SPT400-12-11-25 online

US$ 0.38

Reference Marketing Price: US$ 0.38

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$0.38
10+:
$0.342
50+:
$0.307
100+:
$0.271
500+:
$0.236
1000+:
$0.177
5000+:
$0.153
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Product Parameter

Usage DO-5
Thickness 0.012" (0.305mm)
Thermal Resistivity 0.60°C/W
Thermal Conductivity 0.9 W/m-K
Shape Round
Series Sil-Pad® Tube
Outline 25.02mm x 11.00mm
Other Names BER156
BG300005
BG400628
SPT400 11-25
SPT400121125
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Silicone Rubber
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number SPT400-12-11-25
Expanded Description Thermal Pad Gray, Green 25.02mm x 11.00mm Round
Description THERM PAD TO-220 TUBE 11X25MM
Color Gray, Green
Backing, Carrier -
Adhesive -

Others

Other Names BER156

BG300005

BG400628

SPT400 11-25

SPT400121125
Standard Package 100

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Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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