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LFE2M70E-6F1152C
| EXSHINE Part Number: | EX-LFE2M70E-6F1152C |
|---|---|
| Manufacturer Part Number: | LFE2M70E-6F1152C |
| Manufacturer / Brand: | Lattice Semiconductor |
| Brief Description: | IC FPGA 436 I/O 1152FBGA |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Product Selector GuideECP2(M) Family HandbookECP2(M) Family |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
LFE2M70E-6F1152C
In stock: 28579 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 28579 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage - Supply | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits | 4642816 |
| Supplier Device Package | 1152-FPBGA (35x35) |
| Series | ECP2M |
| Package / Case | 1152-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 67000 |
| Number of LABs/CLBs | 8375 |
| Number of I/O | 436 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Part Number | LFE2M70E-6F1152C |
| Description | IC FPGA 436 I/O 1152FBGA |
Others
| Standard Package | 24 |
|---|
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T/T (Bank Transfer) Receiving: 1-4 days. |
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Lattice Semiconductor Corporation
- Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.