APTGT50SK170T1G

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EXSHINE Part Number:	EX-APTGT50SK170T1G
Manufacturer Part Number:	APTGT50SK170T1G
Manufacturer / Brand:	Microsemi
Brief Description:	IGBT 1700V 75A 312W SP1
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	APTGT50SK170T1G Power Products Catalog
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

APTGT50SK170T1G
In stock: 51060 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
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Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max)	1700V
Vce(on) (Max) @ Vge, Ic	2.4V @ 15V, 50A
Supplier Device Package	SP1
Series	-
Power - Max	312W
Package / Case	SP1
Operating Temperature	-40°C ~ 150°C (TJ)
NTC Thermistor	Yes
Mounting Type	Chassis Mount
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Standard Lead Time	22 Weeks
Manufacturer Part Number	APTGT50SK170T1G
Input Capacitance (Cies) @ Vce	4.4nF @ 25V
Input	Standard
IGBT Type	Trench Field Stop
Expanded Description	IGBT Module Trench Field Stop Single 1700V 75A 312W Chassis Mount SP1
Description	IGBT 1700V 75A 312W SP1
Current - Collector Cutoff (Max)	250µA
Current - Collector (Ic) (Max)	75A
Configuration	Single

Others

Standard Package	1

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	Western Union Receiving: 1-2 hours.
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Microsemi Corporation

- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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