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Home > Products > Integrated Circuits (ICs) > Interface - Specialized > W83667HG-B

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W83667HG-B

EXSHINE Part Number:EX-W83667HG-B
Manufacturer Part Number:W83667HG-B
Manufacturer / Brand:Nuvoton Technology Corporation America
Brief Description:IC LPC SUPER I/O 128LQFP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:W83667HG-B
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
W83667HG-B
In stock: 49080 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order W83667HG-B online

US$ 3.653

Reference Marketing Price: US$ 3.653

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

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$3.653
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Product Parameter

Series *
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Manufacturer Part Number W83667HG-B
Expanded Description Interface
Description IC LPC SUPER I/O 128LQFP

Others

Standard Package 66

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


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Distributor of Nuvoton Technology Corporation of America

- Nuvoton Technology Corp. was founded upon the expectation of the future to create a new era by innovative inspiration.
Nuvoton Technology Corp. was carved-out as a wholly-owned subsidiary of Winbond Electronics Corp. in July 2008. Nuvoton has extended Winbond's product lines of Computer Logic IC business; core technology, partnerships; customers and sales etc., prior to the curve-out, as well as continues to enhance product innovation and to comprehend the needs of terminal application market, and provide superior service to our customers based on the existing foundation.

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