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LS2-130-01-F-D-RA1
| EXSHINE Part Number: | EX-LS2-130-01-F-D-RA1 |
|---|---|
| Manufacturer Part Number: | LS2-130-01-F-D-RA1 |
| Manufacturer / Brand: | Samtec, Inc. |
| Brief Description: | CONN HERMAPHRODITIC 60POS T/H |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | LS2 Series DatasheetLS2 DrawingLS2-1xx-01-x-D-xyx-x Footprint |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 37630 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Series | LS2 |
|---|---|
| Pitch | 0.079" (2.00mm) |
| Packaging | Tube |
| Number of Rows | 2 |
| Number of Positions | 60 |
| Mounting Type | Through Hole, Right Angle |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mated Stacking Heights | - |
| Manufacturer Standard Lead Time | 3 Weeks |
| Manufacturer Part Number | LS2-130-01-F-D-RA1 |
| Height Above Board | 0.208" (5.28mm) |
| Features | Latch Holder |
| Expanded Description | 60 Position Connector Self Mating, Non-Gendered Through Hole, Right Angle Gold |
| Description | CONN HERMAPHRODITIC 60POS T/H |
| Contact Finish Thickness | Flash |
| Contact Finish | Gold |
| Connector Type | Self Mating, Non-Gendered |
Others
| Standard Package | 1 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Samtec Inc.
is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.
With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.