HN1C01FE-GR,LF

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HN1C01FE-GR,LF

EXSHINE Part Number:EX-HN1C01FE-GR,LF
Manufacturer Part Number:HN1C01FE-GR,LF
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:TRANS 2NPN 50V 0.15A ES6
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HN1C01FE
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HN1C01FE-GR,LF
In stock: 19129000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 0.065

Reference Marketing Price: US$ 0.065

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

4000+:
$0.065
8000+:
$0.059
12000+:
$0.052
28000+:
$0.049
65535+:
$0.042
  • Description
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  • Shipping
  • Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max) 50V
Vce Saturation (Max) @ Ib, Ic 250mV @ 10mA, 100mA
Transistor Type 2 NPN (Dual)
Supplier Device Package ES6
Series -
Power - Max 100mW
Packaging Tape & Reel (TR)
Package / Case SOT-563, SOT-666
Other Names HN1C01FE-GR (5L,F,T
HN1C01FE-GR(5L,F,T
HN1C01FE-GR(5LFTTR
HN1C01FE-GR(5LFTTR-ND
HN1C01FE-GR,LF(B
HN1C01FE-GR,LF(T
HN1C01FE-GRLFTR
Operating Temperature 150°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number HN1C01FE-GR,LF
Frequency - Transition 80MHz
Expanded Description Bipolar (BJT) Transistor Array 2 NPN (Dual) 50V 150mA 80MHz 100mW Surface Mount ES6
Description TRANS 2NPN 50V 0.15A ES6
DC Current Gain (hFE) (Min) @ Ic, Vce 200 @ 2mA, 6V
Current - Collector Cutoff (Max) 100nA (ICBO)
Current - Collector (Ic) (Max) 150mA

Others

Other Names HN1C01FE-GR (5L,F,T

HN1C01FE-GR(5L,F,T

HN1C01FE-GR(5LFTTR

HN1C01FE-GR(5LFTTR-ND

HN1C01FE-GR,LF(B

HN1C01FE-GR,LF(T

HN1C01FE-GRLFTR
Standard Package 4,000

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Distributor of Toshiba Semiconductor and Storage

- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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