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XC3S700AN-4FGG484I
| EXSHINE Part Number: | EX-XC3S700AN-4FGG484I |
|---|---|
| Manufacturer Part Number: | XC3S700AN-4FGG484I |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | IC FPGA 372 I/O 484FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Spartan-3AN BrochureSpartan-3AN FPGA DatasheetExtended Spartan-3A Family OverviewXC3S700AN FPGA Errata |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XC3S700AN-4FGG484I
In stock: 55890 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 55890 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage - Supply | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits | 368640 |
| Supplier Device Package | 484-FBGA (23x23) |
| Series | Spartan®-3AN |
| Package / Case | 484-BBGA |
| Other Names | 122-1598 XC3S700AN-4FGG484I-ND XC3S700AN4FGG484I |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells | 13248 |
| Number of LABs/CLBs | 1472 |
| Number of I/O | 372 |
| Number of Gates | 700000 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Standard Lead Time | 6 Weeks |
| Manufacturer Part Number | XC3S700AN-4FGG484I |
| Description | IC FPGA 372 I/O 484FBGA |
Others
| Standard Package | 60 |
|---|---|
| Other Names | 122-1598 XC3S700AN-4FGG484I-ND XC3S700AN4FGG484I |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Xilinx Inc.
- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.