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XCZU17EG-L1FFVD1760I

EXSHINE Part Number:EX-XCZU17EG-L1FFVD1760I
Manufacturer Part Number:XCZU17EG-L1FFVD1760I
Manufacturer / Brand:Xilinx
Brief Description:IC FPGA 308 I/O 1760FCBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Zynq UltraScale+ MPSoC Datasheet
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Weight:-
Alternative Replacement:-
Real Time Availability for
XCZU17EG-L1FFVD1760I
In stock: 4332 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Supplier Device Package 1760-FCBGA (42.5x42.5)
Speed 600MHz, 1.5GHz
Series Zynq® UltraScale+™ MPSoC EG
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Peripherals DMA, WDT
Packaging Tray
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ)
Number of I/O 308
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Manufacturer Part Number XCZU17EG-L1FFVD1760I
MCU RAM 256KB
MCU Flash -
Expanded Description Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 256KB 600MHz, 1.5GHz 1760-FCBGA (42.5x42.5)
Description IC FPGA 308 I/O 1760FCBGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA

Others

Standard Package 1

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Distributor of Xilinx Inc.

- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.

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