151230-7422-TB

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151230-7422-TB

EXSHINE Part Number:EX-151230-7422-TB
Manufacturer Part Number:151230-7422-TB
Manufacturer / Brand:3M
Brief Description:CONN 30POS2MM HEADER RT/DUAL GLD
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:1512-RB Series Datasheet1512 Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
151230-7422-TB
In stock: 74609 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series 1512
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Packaging Bulk
Overall Contact Length -
Other Names 1512307422TB
3M1230
5113826129
51138261290
80-1300-7530-4
80130075304
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 30
Mounting Type Through Hole, Right Angle
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Part Number 151230-7422-TB
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Insulation Height 0.165" (4.20mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type -
Expanded Description 30 Positions Header Connector 0.079" (2.00mm) Through Hole, Right Angle Gold
Description CONN 30POS2MM HEADER RT/DUAL GLD
Current Rating 1A
Contact Type Male Pin
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post 0.118" (3.00mm)
Contact Length - Mating 0.152" (3.86mm)
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Tin-Lead
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Other Names 1512307422TB

3M1230

5113826129

51138261290

80-1300-7530-4

80130075304
Standard Package 500

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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