200-6319-9UN-1900

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200-6319-9UN-1900

EXSHINE Part Number:EX-200-6319-9UN-1900
Manufacturer Part Number:200-6319-9UN-1900
Manufacturer / Brand:3M
Brief Description:CONN SOCKET PGA ZIF 361POS GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Test & Burn-In PGA Kit SocketsTxtool™ Burn-In Grid ZIP SocketsSOIC Socket Pin Sequence
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
200-6319-9UN-1900
In stock: 64620 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 200-6319-9UN-1900 online

US$ 75.29

Reference Marketing Price: US$ 75.29

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$75.29
10+:
$70.864
25+:
$68.65
50+:
$64.221
100+:
$60.677
250+:
$58.906
500+:
$57.577
  • Description
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Product Parameter

Type PGA, ZIF (ZIP)
Termination Post Length 0.130" (3.30mm)
Termination Solder
Series Textool™
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names 0 51138 69648 1
20063199UN1900
3M5071
5113869648
51138696481
JE150901336
Operating Temperature -55°C ~ 150°C
Number of Positions or Pins (Grid) 361 (19 x 19)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number 200-6319-9UN-1900
Housing Material Polyethersulfone (PES)
Features -
Description CONN SOCKET PGA ZIF 361POS GOLD
Current Rating 1A
Contact Resistance -
Contact Material - Post Beryllium Copper
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post 30µin (0.76µm)
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold

Others

Other Names 0 51138 69648 1

20063199UN1900

3M5071

5113869648

51138696481

JE150901336
Standard Package 10

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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