220-3342-00-0602J

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220-3342-00-0602J

EXSHINE Part Number:EX-220-3342-00-0602J
Manufacturer Part Number:220-3342-00-0602J
Manufacturer / Brand:3M
Brief Description:CONN IC DIP SOCKET ZIF 20POS GLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:.100" (2.54 mm) DIP SocketsSOIC Socket Pin Sequence
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
220-3342-00-0602J
In stock: 15980 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 220-3342-00-0602J online

US$ 18.94

Reference Marketing Price: US$ 18.94

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$18.94
10+:
$17.589
25+:
$15.785
50+:
$15.334
100+:
$13.53
250+:
$12.628
500+:
$12.357
1000+:
$11.726
  • Description
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  • Shipping
  • Packaging

Product Parameter

Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Termination Post Length 0.110" (2.78mm)
Termination Press-Fit
Series Textool™
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names 2-002003342000006002
2002003342-000006002
220-3342-00-0602
2203342000602J
3M2002
51138-69542-2
5113869542
51138695422
5400733892
54007338925
80-6101-2473-9
80610124739
JE-1509-0022-1
JE150900221
Operating Temperature -55°C ~ 125°C
Number of Positions or Pins (Grid) 20 (2 x 10)
Mounting Type Connector
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number 220-3342-00-0602J
Housing Material Polysulfone (PSU), Glass Filled
Features Closed Frame
Description CONN IC DIP SOCKET ZIF 20POS GLD
Current Rating 1A
Contact Resistance -
Contact Material - Post Beryllium Copper
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post 30µin (0.76µm)
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold

Others

Standard Package 10
Other Names 2-002003342000006002

2002003342-000006002

220-3342-00-0602

2203342000602J

3M2002

51138-69542-2

5113869542

51138695422

5400733892

54007338925

80-6101-2473-9

80610124739

JE-1509-0022-1

JE150900221

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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