224-7397-55-1902

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224-7397-55-1902

EXSHINE Part Number:EX-224-7397-55-1902
Manufacturer Part Number:224-7397-55-1902
Manufacturer / Brand:3M
Brief Description:CONN SOCKET SOIC 24POS GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Test & Burn-In SOIC Sockets DatasheetSOIC Socket Pin Sequence
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
224-7397-55-1902
In stock: 95970 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 224-7397-55-1902 online

US$ 33.67

Reference Marketing Price: US$ 33.67

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$33.67
10+:
$30.394
25+:
$29.12
50+:
$27.30
100+:
$26.39
250+:
$24.934
500+:
$24.206
1000+:
$23.66
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Type SOIC
Termination Post Length 0.140" (3.56mm)
Termination Solder
Series Textool™
Pitch - Post -
Pitch - Mating -
Packaging Bulk
Other Names 0 51138 69617 7
2.2474E+12
2247397551902
3M5058
5113869617
51138696177
JE150900882
Operating Temperature -55°C ~ 150°C
Number of Positions or Pins (Grid) 24 (2 x 12)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number 224-7397-55-1902
Housing Material Polyethersulfone (PES), Glass Filled
Features Closed Frame
Description CONN SOCKET SOIC 24POS GOLD
Current Rating 1A
Contact Resistance -
Contact Material - Post Beryllium Copper
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post 30µin (0.76µm)
Contact Finish Thickness - Mating -
Contact Finish - Post Gold
Contact Finish - Mating Gold

Others

Other Names 0 51138 69617 7

2.2474E+12

2247397551902

3M5058

5113869617

51138696177

JE150900882
Standard Package 10

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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