EXSHINE Part Number: | EX-224-7397-55-1902 |
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Manufacturer Part Number: | 224-7397-55-1902 |
Manufacturer / Brand: | 3M |
Brief Description: | CONN SOCKET SOIC 24POS GOLD |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | Test & Burn-In SOIC Sockets DatasheetSOIC Socket Pin Sequence |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Type | SOIC |
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Termination Post Length | 0.140" (3.56mm) |
Termination | Solder |
Series | Textool™ |
Pitch - Post | - |
Pitch - Mating | - |
Packaging | Bulk |
Other Names | 0 51138 69617 7 2.2474E+12 2247397551902 3M5058 5113869617 51138696177 JE150900882 |
Operating Temperature | -55°C ~ 150°C |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Flammability Rating | UL94 V-0 |
Manufacturer Standard Lead Time | 8 Weeks |
Manufacturer Part Number | 224-7397-55-1902 |
Housing Material | Polyethersulfone (PES), Glass Filled |
Features | Closed Frame |
Description | CONN SOCKET SOIC 24POS GOLD |
Current Rating | 1A |
Contact Resistance | - |
Contact Material - Post | Beryllium Copper |
Contact Material - Mating | Beryllium Copper |
Contact Finish Thickness - Post | 30µin (0.76µm) |
Contact Finish Thickness - Mating | - |
Contact Finish - Post | Gold |
Contact Finish - Mating | Gold |
Other Names | 0 51138 69617 7 2.2474E+12 2247397551902 3M5058 5113869617 51138696177 JE150900882 |
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Standard Package | 10 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.