Photo for reference only Contact us for more images
232-1297-00-3303
| EXSHINE Part Number: | EX-232-1297-00-3303 |
|---|---|
| Manufacturer Part Number: | 232-1297-00-3303 |
| Manufacturer / Brand: | 3M |
| Brief Description: | CONN IC DIP SOCKET ZIF 32POS GLD |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | OEM ZIP DIP Sockets |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 90660 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
|---|---|
| Termination Post Length | 0.110" (2.78mm) |
| Termination | Solder |
| Series | OEM |
| Pitch - Post | 0.100" (2.54mm) |
| Pitch - Mating | 0.100" (2.54mm) |
| Packaging | Bulk |
| Other Names | 2321297003303 5113523884 51135238844 JE150126223 Q975838 |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 32 (2 x 16) |
| Mounting Type | Through Hole |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Material Flammability Rating | UL94 V-0 |
| Manufacturer Standard Lead Time | 8 Weeks |
| Manufacturer Part Number | 232-1297-00-3303 |
| Housing Material | Polyether Imide (PEI), Glass Filled |
| Features | Closed Frame |
| Description | CONN IC DIP SOCKET ZIF 32POS GLD |
| Current Rating | 1A |
| Contact Resistance | 25 mOhm |
| Contact Material - Post | Beryllium Copper |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | 250µin (6.35µm) |
| Contact Finish Thickness - Mating | 250µin (6.35µm) |
| Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold |
Others
| Standard Package | 100 |
|---|---|
| Other Names | 2321297003303 5113523884 51135238844 JE150126223 Q975838 |
|
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
|
Paypal Receiving: immediately. |
|
|
Western Union Receiving: 1-2 hours. |
|
|
MoneyGram Receiving: 1-2 hours. |
|
|
Alipay Receiving: immediately. |
 |
DHL EXPRESS Delivery time: 1-3 days. |
 |
FEDEX EXPRESS Delivery time: 1-3 days. |
 |
UPS EXPRESS Delivery time: 2-4 days. |
 |
TNT EXPRESS Delivery time: 3-6 days. |
 |
EMS EXPRESS Delivery time: 7-10 days. |
Related Product
-
PictureMfg. Part NumberManufacturersBrief DescriptionDatasheetIn StockItem PriceOrder Online -
232-20CNC TechCONN SOCKET PLCC 20POS TINDownloadViewUS$ 0.255Inquiry -
232-200ABWakefield-VetteHEATSINK TO-220 VERTDownloadViewUS$ 0.63Inquiry -
232-1287-00-0602J3MCONN IC DIP SOCKET ZIF 32POS GLDDownloadViewUS$ 20.644Inquiry -
232-131-ANFHOTBUY232-131-A NFHOTBUY SMD or Through Hole new date code and low priceViewInquiry -
232-1285-00-0602J(600MIL)M232-1285-00-0602J(600MIL) SMD or Through Hole Original Package StockViewInquiry -
232-200ABE-23Wakefield-VetteHEATSINK TO-220 VERTDownloadViewUS$ 0.778Inquiry -
232-18MMX55M3MTAPE MASKING HI-PERFORM 18MMX55MDownloadViewUS$ 9.4Inquiry -
232-166WGONew Stocks 232-166 WGO SMD or Through HoleViewInquiry -
232-1285-00-0602J3MCONN IC DIP SOCKET ZIF 32POS GLDDownloadViewUS$ 13.533Inquiry -
232-1291-00-0602J3MCONN IC DIP SOCKET ZIF 32POS GLDDownloadViewUS$ 18.083Inquiry -
232-1285-39-0602J3MRECEPTACLE DIP SOCKET 32POS .6"DownloadViewUS$ 24.895Inquiry -
232-1291-00M232-1291-00 SMD or Through Hole Original Package StockViewInquiry -
232-1285-09-0602J3MRECEPTACLE DIP SOCKET 32POS .6"DownloadViewUS$ 14.859Inquiry -
232-12MMX55M3MTAPE MASKING HI-PERFORM 12MMX55MDownloadViewUS$ 6.707Inquiry -
232-1285-0602JM232-1285-0602J M STOCK new date code and low priceViewInquiry -
232-163WGONew Stocks 232-163 WGO SMD or Through HoleViewInquiry -
232-1285-19-0602J3MRECEPTACLE DIP SOCKET 32POS .6"DownloadViewUS$ 15.743Inquiry -
232-200CTWAK232-200CT WAK ORIGINAL new date code and low priceViewInquiry -
232-1285-29-0602J3MRECEPTACLE DIP SOCKET 32POS .6"DownloadViewUS$ 10.881Inquiry -
232-2"X60YD3MTAPE MASK HI-PERFORM 2" X 60YDDownloadViewUS$ 22.848Inquiry
Distributor of 3M
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.