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25T-BBE6

EXSHINE Part Number:EX-25T-BBE6
Manufacturer Part Number:25T-BBE6
Manufacturer / Brand:3M
Brief Description:1/2" X25' BOND BRAID W/EYELETS
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:25T-BBE6
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
25T-BBE6
In stock: 73470 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 25T-BBE6 online

US$ 92.34

Reference Marketing Price: US$ 92.34

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$92.34
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Product Parameter

Wire Gauge - Ends -
Type Flat
Thickness -
Size, Supplied 0.500" (12.70mm, 1/2") - Width
Series Scotch® 25
Other Names 00054007326717
05400732671
80610096150
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Copper, Tin Plated
Manufacturer Standard Lead Time 4 Weeks
Manufacturer Part Number 25T-BBE6
Length 25.0' (7.62m)
Expanded Description Flat Ground Braid 0.500" (12.70mm, 1/2") - Width X 25.0' (7.62m)
Description 1/2" X25' BOND BRAID W/EYELETS

Others

Standard Package 1
Other Names 00054007326717

05400732671

80610096150

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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 Western Union
 Receiving: 1-2 hours.

 MoneyGram
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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