2908-05WB-MG

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2908-05WB-MG

EXSHINE Part Number:EX-2908-05WB-MG
Manufacturer Part Number:2908-05WB-MG
Manufacturer / Brand:3M
Brief Description:CONN MICRO SD CARD PUSH-PUSH R/A
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:2900 Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
2908-05WB-MG
In stock: 64630 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 2908-05WB-MG online

US$ 1.9

Reference Marketing Price: US$ 1.9

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1000+:
$1.90
2000+:
$1.834
3000+:
$1.769
5000+:
$1.703
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Product Parameter

Series 2900
Packaging Tape & Reel (TR)
Other Names 0-00-51111-74537-3
00051111745373
290805WBMG
3M5607TR
XE-0042-2512-6
XE004225126
XE004235126
Number of Positions 10 (8 + 2)
Mounting Type Surface Mount, Right Angle
Mounting Feature Normal, Standard - Top
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 10 Weeks
Manufacturer Part Number 2908-05WB-MG
Insertion, Removal Method Push In, Push Out
Height Above Board 0.073" (1.85mm)
Features Switch
Expanded Description 10 (8 + 2) Position Card Connector Secure Digital - microSD™ Surface Mount, Right Angle Gold
Ejector Side -
Description CONN MICRO SD CARD PUSH-PUSH R/A
Contact Finish Thickness 15µin (0.38µm)
Contact Finish Gold
Connector Type Connector and Ejector
Card Type Secure Digital - microSD™

Others

Other Names 0-00-51111-74537-3

00051111745373

290805WBMG

3M5607TR

XE-0042-2512-6

XE004225126

XE004235126
Standard Package 1,000

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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