31041

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EXSHINE Part Number:	EX-31041
Manufacturer Part Number:	31041
Manufacturer / Brand:	3M
Brief Description:	CONN TERM RECT 3/0 AWG #1/2
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	Scotchlok™ 30000, 31000 Series Datasheet
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

31041
In stock: 41340 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Packaging

Product Parameter

Wire Gauge	3/0 AWG
Width - Outer Edges	0.910" (23.11mm)
Termination	Crimp, Barrel
Terminal Type	Standard
Terminal Style	Single Stud Hole
Tab Thickness	-
Stud/Tab Size	1/2 Stud
Series	Scotchlok™ 31000
Packaging	Bulk
Other Names	00054007125761 05400712576 80610033377
Mounting Type	Free Hanging (In-Line)
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Standard Lead Time	3 Weeks
Manufacturer Part Number	31041
Length - Overall	3.130" (79.50mm)
Insulation	Non-Insulated
Features	-
Expanded Description	Terminal Connector Rectangular Standard 3/0 AWG 1/2 Stud
Diameter - Ring ID	-
Diameter - Barrel OD	0.617" (15.67mm)
Diameter - Barrel ID	0.490" (12.45mm)
Description	CONN TERM RECT 3/0 AWG #1/2
Contact Material	Copper
Contact Finish	Electro-Tin
Color	Orange

Others

Standard Package	10
Other Names	00054007125761 05400712576 80610033377

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	Western Union Receiving: 1-2 hours.
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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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