32.7MM-32.7MM-25-8810

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32.7MM-32.7MM-25-8810

EXSHINE Part Number:EX-32.7MM-32.7MM-25-8810
Manufacturer Part Number:32.7MM-32.7MM-25-8810
Manufacturer / Brand:3M
Brief Description:32.7MM X 32.7MM 1=25/PK
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:88xx Tape
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
32.7MM-32.7MM-25-8810
In stock: 83280 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 32.7MM-32.7MM-25-8810 online

US$ 29.58

Reference Marketing Price: US$ 29.58

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Product Parameter

Usage Sheet
Thickness 0.010" (0.254mm)
Thermal Resistivity -
Thermal Conductivity 0.6 W/m-K
Shape Square
Series 8810
Outline 32.70mm x 32.70mm
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Acrylic
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 32.7MM-32.7MM-25-8810
Expanded Description Thermal Pad White 32.70mm x 32.70mm Square Adhesive - Both Sides
Description 32.7MM X 32.7MM 1=25/PK
Color White
Backing, Carrier Polyester
Adhesive Adhesive - Both Sides

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M (TC)

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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