3485-2400F

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3485-2400F

EXSHINE Part Number:EX-3485-2400F
Manufacturer Part Number:3485-2400F
Manufacturer / Brand:3M
Brief Description:BACKSHELL, 37PIN PLASTIC CABLE
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:3485-2x00(F,R)Short Form Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
3485-2400F
In stock: 60810 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 3485-2400F online

US$ 8.28

Reference Marketing Price: US$ 8.28

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$8.28
10+:
$7.92
25+:
$7.20
50+:
$6.84
100+:
$6.66
250+:
$5.94
500+:
$5.58
1000+:
$4.932
2500+:
$4.68
  • Description
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Product Parameter

Shielding Unshielded
Series 3485
Plating -
Other Names 3485-2400
34852400F
5400736335
54007363354
80-6101-8218-2
80610182182
MDBF37
Number of Positions 37
Material Polybutylene Terephthalate, Glass Filled
Manufacturer Standard Lead Time 4 Weeks
Manufacturer Part Number 3485-2400F
Hardware Assembly Hardware
Features -
Expanded Description 37 Position Two Piece Backshell Connector Gray 180° Unshielded
Description BACKSHELL, 37PIN PLASTIC CABLE
Color Gray
Cable Type Flat
Cable Exit 180°
Accessory Type Two Piece Backshell

Others

Other Names 3485-2400

34852400F

5400736335

54007363354

80-6101-8218-2

80610182182

MDBF37
Standard Package 100

You can choose the below payment options. Please contact our sales team if you have any questions.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 1-3 days.
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 Delivery time: 3-6 days.
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 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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