3E306-3200-008

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3E306-3200-008

EXSHINE Part Number:EX-3E306-3200-008
Manufacturer Part Number:3E306-3200-008
Manufacturer / Brand:3M
Brief Description:SHELL KIT FOR IEEE-1394 RCPT
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:3E306 SeriesShort Form Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
3E306-3200-008
In stock: 45820 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 3E306-3200-008 online

US$ 10.93

Reference Marketing Price: US$ 10.93

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$10.93
10+:
$10.45
50+:
$9.025
100+:
$8.788
250+:
$7.838
500+:
$7.363
1000+:
$6.508
2500+:
$6.175
  • Description
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Product Parameter

Series 3E306
Other Names 3E3063200008
3M9421
4548623140094
4862314009
54862314009
JE150394417
JE150431474
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number 3E306-3200-008
For Use With/Related Products Firewire (IEEE 1394) Receptacles
Expanded Description Connector Shell Kit For Firewire (IEEE 1394) Receptacles
Description SHELL KIT FOR IEEE-1394 RCPT
Accessory Type Shell Kit

Others

Other Names 3E3063200008

3M9421

4548623140094

4862314009

54862314009

JE150394417

JE150431474
Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

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 Receiving: 1-4 days.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
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 UPS EXPRESS
 Delivery time: 2-4 days.
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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