3M863X LAPPING 4.125 IN

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EXSHINE Part Number:	EX-3M863X LAPPING 4.125 IN
Manufacturer Part Number:	3M863X LAPPING 4.125 IN
Manufacturer / Brand:	3M
Brief Description:	LAPP FILM SILICON DIOXIDE 4.13"
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	Fiber Optic Polishing Brochure 863X(W), 865X Series Brochure
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

3M863X LAPPING 4.125 IN
In stock: 62770 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
Payment
Shipping
Packaging

Product Parameter

Weight	-
Type	Lapping Film
Specifications	Silicon Dioxide
Size / Dimension	4.13" Dia (105.0mm)
Series	863X
Other Names	00051111700945 3M10807 3M863XLAPPING4125IN 60020013300
Manufacturer Standard Lead Time	3 Weeks
Manufacturer Part Number	3M863X LAPPING 4.125 IN
For Use With/Related Products	Fiber Optics Connectors
Expanded Description	Lapping Film Silicon Dioxide 4.13" Dia (105.0mm)
Description	LAPP FILM SILICON DIOXIDE 4.13"

Others

Other Names	00051111700945 3M10807 3M863XLAPPING4125IN 60020013300
Standard Package	4,000

You can choose the below payment options. Please contact our sales team if you have any questions.

	T/T (Bank Transfer) Receiving: 1-4 days.
	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
	MoneyGram Receiving: 1-2 hours.
	Alipay Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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25 IN
3M863