4814-3004-CP

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4814-3004-CP

EXSHINE Part Number:EX-4814-3004-CP
Manufacturer Part Number:4814-3004-CP
Manufacturer / Brand:3M
Brief Description:CONN IC DIP SOCKET 14POS TIN
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:4800 Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
4814-3004-CP
In stock: 55663000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 4814-3004-CP online

US$ 0.48

Reference Marketing Price: US$ 0.48

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$0.48
10+:
$0.45
25+:
$0.405
50+:
$0.36
100+:
$0.345
250+:
$0.315
500+:
$0.30
1000+:
$0.248
2500+:
$0.225
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Product Parameter

Type DIP, 0.3" (7.62mm) Row Spacing
Termination Post Length -
Termination Solder
Series 4800
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Tube
Other Names 00051111752326
3M5474
48143004CP
5111175232
51111752326
80000913071
Operating Temperature -25°C ~ 85°C
Number of Positions or Pins (Grid) 14 (2 x 7)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 7 Weeks
Manufacturer Part Number 4814-3004-CP
Housing Material Polyester, Glass Filled
Features Open Frame
Description CONN IC DIP SOCKET 14POS TIN
Current Rating 1A
Contact Resistance -
Contact Material - Post Phosphor Bronze
Contact Material - Mating Phosphor Bronze
Contact Finish Thickness - Post 35µin (0.90µm)
Contact Finish Thickness - Mating 35µin (0.90µm)
Contact Finish - Post Tin
Contact Finish - Mating Tin

Others

Standard Package 11,200
Other Names 00051111752326

3M5474

48143004CP

5111175232

51111752326

80000913071

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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