4832-6000-CP

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EXSHINE Part Number:	EX-4832-6000-CP
Manufacturer Part Number:	4832-6000-CP
Manufacturer / Brand:	3M
Brief Description:	CONN IC DIP SOCKET 32POS TIN
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	4800 Series
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

4832-6000-CP
In stock: 25664000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Type	DIP, 0.6" (15.24mm) Row Spacing
Termination Post Length	-
Termination	Solder
Series	4800
Pitch - Post	0.100" (2.54mm)
Pitch - Mating	0.100" (2.54mm)
Packaging	Tube
Other Names	00051111752517 3M5470 48326000CP 5111175251 51111752517 80000913261
Operating Temperature	-25°C ~ 85°C
Number of Positions or Pins (Grid)	32 (2 x 16)
Mounting Type	Through Hole
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Material Flammability Rating	UL94 V-0
Manufacturer Standard Lead Time	7 Weeks
Manufacturer Part Number	4832-6000-CP
Housing Material	Polyester, Glass Filled
Features	Open Frame
Description	CONN IC DIP SOCKET 32POS TIN
Current Rating	1A
Contact Resistance	-
Contact Material - Post	Phosphor Bronze
Contact Material - Mating	Phosphor Bronze
Contact Finish Thickness - Post	35µin (0.90µm)
Contact Finish Thickness - Mating	35µin (0.90µm)
Contact Finish - Post	Tin
Contact Finish - Mating	Tin

Others

Other Names	00051111752517 3M5470 48326000CP 5111175251 51111752517 80000913261
Standard Package	2,880

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	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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