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4P02-2G02-DA
| EXSHINE Part Number: | EX-4P02-2G02-DA |
|---|---|
| Manufacturer Part Number: | 4P02-2G02-DA |
| Manufacturer / Brand: | 3M |
| Brief Description: | CONN FOR PC104 EMB SYS APS 64 CO |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | 4P02-2G02-DA |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 74250 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage Rating | - |
|---|---|
| Termination | Solder |
| Series | 4P02 |
| Pitch | 0.100" (2.54mm) |
| Packaging | Tray |
| Other Names | 00051115593772 05111559377 70010027970 |
| Operating Temperature | -40°C ~ 105°C |
| Number of Rows | 2 |
| Number of Positions Loaded | All |
| Number of Positions | 64 |
| Number of Columns | - |
| Mounting Type | Through Hole |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Material Flammability Rating | UL94 V-0 |
| Manufacturer Standard Lead Time | 9 Weeks |
| Manufacturer Part Number | 4P02-2G02-DA |
| Features | - |
| Description | CONN FOR PC104 EMB SYS APS 64 CO |
| Current Rating | 3A |
| Contact Layout, Typical | - |
| Contact Finish Thickness | 3µin (0.08µm) |
| Contact Finish | Gold |
| Connector Usage | - |
| Connector Type | Non-Stackthrough, (PC/104) |
| Connector Style | PC/104 |
| Color | - |
Others
| Standard Package | 665 |
|---|---|
| Other Names | 00051115593772 05111559377 70010027970 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of 3M
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.