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500-032-050
| EXSHINE Part Number: | EX-500-032-050 |
|---|---|
| Manufacturer Part Number: | 500-032-050 |
| Manufacturer / Brand: | 3M |
| Brief Description: | CONN SOCKET SIP 32POS GOLD |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | 500 Series |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 34525 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Type | SIP |
|---|---|
| Termination Post Length | - |
| Termination | - |
| Series | - |
| Pitch - Post | 0.100" (2.54mm) |
| Pitch - Mating | 0.100" (2.54mm) |
| Packaging | - |
| Operating Temperature | - |
| Number of Positions or Pins (Grid) | 32 (1 x 32) |
| Mounting Type | Through Hole |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Material Flammability Rating | - |
| Manufacturer Part Number | 500-032-050 |
| Housing Material | - |
| Features | Closed Frame |
| Description | CONN SOCKET SIP 32POS GOLD |
| Current Rating | - |
| Contact Resistance | - |
| Contact Material - Post | - |
| Contact Material - Mating | - |
| Contact Finish Thickness - Post | 8µin (0.20µm) |
| Contact Finish Thickness - Mating | 8µin (0.20µm) |
| Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold |
Others
| Standard Package | 200 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of 3M
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.