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81050-600C07-RB

EXSHINE Part Number:EX-81050-600C07-RB
Manufacturer Part Number:81050-600C07-RB
Manufacturer / Brand:3M
Brief Description:4WALL TRIPOLARIZ HEADER 50 CONTA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:81050-600C07-RB
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
81050-600C07-RB
In stock: 16030 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 10.244

Reference Marketing Price: US$ 10.244

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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Cable/Wire
Shrouding Shrouded - 4 Wall
Series 810
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.050" (1.27mm)
Packaging Tray
Overall Contact Length -
Other Names 00051111939123
05111193912
80001234600
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 50
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 6 Weeks
Manufacturer Part Number 81050-600C07-RB
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.405" (10.29mm)
Insulation Color Black
Ingress Protection -
Features Retention Clips
Fastening Type -
Expanded Description 50 Positions Header Connector 0.050" (1.27mm) Surface Mount Gold
Description 4WALL TRIPOLARIZ HEADER 50 CONTA
Current Rating 0.75A
Contact Type Male Pin
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post -
Contact Length - Mating 0.140" (3.56mm)
Contact Finish Thickness - Post 250µin (6.35µm)
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Other Names 00051111939123

05111193912

80001234600
Standard Package 100

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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