89114-0001

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89114-0001

EXSHINE Part Number:EX-89114-0001
Manufacturer Part Number:89114-0001
Manufacturer / Brand:3M
Brief Description:CONN 14 POS IDC SOCKET GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:891 Series .100"x.100"Short Form Catalog891 Series Contact Drawing891 Series Product SpecInterconnect Solutions Mating Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
89114-0001
In stock: 71277000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 89114-0001 online

US$ 1.1

Reference Marketing Price: US$ 1.1

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$1.10
10+:
$0.969
25+:
$0.912
50+:
$0.874
100+:
$0.836
250+:
$0.76
500+:
$0.684
1000+:
$0.608
2500+:
$0.551
  • Description
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Product Parameter

Wire Type Ribbon Cable
Wire Gauge 26-28 AWG
Series 891
Row Spacing 0.100" (2.54mm)
Pitch 0.100" (2.54mm)
Packaging Bulk
Other Names 5400754453
54007544531
80-6107-0638-6
80610706386
891140001
MSC14A
MSC14G
Number of Rows 2
Number of Positions 14
Mounting Type Free Hanging (In-Line)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 89114-0001
Features Feed Through
Fastening Type -
Expanded Description 14 Position Rectangular Receptacle Connector IDC Gold 26-28 AWG
Description CONN 14 POS IDC SOCKET GOLD
Contact Type Female Socket
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle
Color Gray
Cable Termination IDC

Others

Standard Package 500
Other Names 5400754453

54007544531

80-6107-0638-6

80610706386

891140001

MSC14A

MSC14G

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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