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923719

EXSHINE Part Number:EX-923719
Manufacturer Part Number:923719
Manufacturer / Brand:3M
Brief Description:TEST CLIP 32POS DIP NAIL-HEAD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Test Clips and Accessories Brochure
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
923719
In stock: 71070 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 923719 online

US$ 37.126

Reference Marketing Price: US$ 37.126

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

10+:
$37.126
  • Description
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Product Parameter

Type DIP, .600"
Series 923
Other Names 05400782184
5400782184
54007821847
80610336879
Number of Positions or Pins (Grid) 32 (2 x 16)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 923719
Description TEST CLIP 32POS DIP NAIL-HEAD
Contact Material Copper Alloy
Contact Finish Gold

Others

Other Names 05400782184

5400782184

54007821847

80610336879
Standard Package 10

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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