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926142-01-27-I

EXSHINE Part Number:EX-926142-01-27-I
Manufacturer Part Number:926142-01-27-I
Manufacturer / Brand:3M
Brief Description:CONN HEADER 54POS DL .100" GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:92x Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
926142-01-27-I
In stock: 15780 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 7.161

Reference Marketing Price: US$ 7.161

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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board
Shrouding Unshrouded
Series 92X
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Overall Contact Length 0.628" (15.95mm)
Other Names 00076308066475
07630806647
7630806647
76308066475
80001345760
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 54
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 926142-01-27-I
Insulation Material Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type -
Expanded Description 54 Positions Header Connector 0.100" (2.54mm) Through Hole Gold
Description CONN HEADER 54POS DL .100" GOLD
Current Rating 2.5A
Contact Type Male Pin
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post 0.100" (2.54mm)
Contact Length - Mating 0.428" (10.87mm)
Contact Finish Thickness - Post 10µin (0.25µm)
Contact Finish Thickness - Mating 10µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Standard Package 100
Other Names 00076308066475

07630806647

7630806647

76308066475

80001345760

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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