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939852-01-32-RB

EXSHINE Part Number:EX-939852-01-32-RB
Manufacturer Part Number:939852-01-32-RB
Manufacturer / Brand:3M
Brief Description:CONN SOCKET 64POS DL .100" GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:929, 939 Series, Boardmount Socket Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
939852-01-32-RB
In stock: 13180 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 4.403

Reference Marketing Price: US$ 4.403

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Product Parameter

Voltage Rating 1500V
Termination Kinked Pin, Solder
Style Board to Board
Series 929
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names 00076308059033
07630805903
7630805903
76308059033
80001338328
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 64
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 939852-01-32-RB
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Insulation Height 0.325" (8.25mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Expanded Description 64 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold
Description CONN SOCKET 64POS DL .100" GOLD
Current Rating 2A
Contact Type Forked
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post 0.125" (3.18mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Receptacle
Applications -

Others

Standard Package 100
Other Names 00076308059033

07630805903

7630805903

76308059033

80001338328

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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