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966260-2000-AR-TP

EXSHINE Part Number:EX-966260-2000-AR-TP
Manufacturer Part Number:966260-2000-AR-TP
Manufacturer / Brand:3M
Brief Description:CONN SOCKET LO-PRO 60PS GOLD SMD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:9662xx-2000-AR-xx Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
966260-2000-AR-TP
In stock: 29380 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 966260-2000-AR-TP online

US$ 6.716

Reference Marketing Price: US$ 6.716

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120+:
$6.716
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Product Parameter

Voltage Rating 1000VDC
Termination Solder
Style Board to Board
Series 966
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Tube
Other Names DE500060723
ZZ150355174
Operating Temperature -25°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 60
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 9 Weeks
Manufacturer Part Number 966260-2000-AR-TP
Insulation Material Thermoplastic
Insulation Height 0.197" (5.00mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Expanded Description 60 Position Receptacle, Bottom or Top Entry Connector 0.100" (2.54mm) Surface Mount Gold
Description CONN SOCKET LO-PRO 60PS GOLD SMD
Current Rating 2A
Contact Type Female Socket
Contact Shape Square
Contact Material Copper Alloy
Contact Length - Post -
Contact Finish Thickness - Post 40µin (1.02µm)
Contact Finish Thickness - Mating Flash
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Receptacle, Bottom or Top Entry
Applications -

Others

Standard Package 120
Other Names DE500060723

ZZ150355174

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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