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Home > Products > Connectors, Interconnects > Terminals - Wire Splice Connectors > BSV18L

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BSV18L

EXSHINE Part Number:EX-BSV18L
Manufacturer Part Number:BSV18L
Manufacturer / Brand:3M
Brief Description:CONN SPLICE 18-22 AWG CRIMP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:BSV18L
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
BSV18L
In stock: 19858 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order BSV18L online

US$ 0

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  • Description
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Product Parameter

Wire Gauge 18-22 AWG
Termination Crimp
Terminal Type Butt Splice, Inline, Individual Openings
Series Highland™
Packaging Bulk
Other Names 00054007702689
05400770268
80610555817
Number of Wire Entries 2
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number BSV18L
Insulation Fully Insulated
Features -
Expanded Description Terminal Butt Splice, Inline, Individual Openings Connector Crimp 18-22 AWG Red
Description CONN SPLICE 18-22 AWG CRIMP
Color Red

Others

Standard Package 10
Other Names 00054007702689

05400770268

80610555817

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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