CP2-HC055-GE1-TG30

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EXSHINE Part Number:	EX-CP2-HC055-GE1-TG30
Manufacturer Part Number:	CP2-HC055-GE1-TG30
Manufacturer / Brand:	3M
Brief Description:	CONN HEADER TYP-C 55POS VERT AU
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	CP2 Press-Fit Header Type C
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

CP2-HC055-GE1-TG30
In stock: 68645 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
Payment
Shipping
Packaging

Product Parameter

Voltage Rating	-
Termination	Press-Fit
Series	MetPak™ CP2
Pitch	0.079" (2.00mm)
Packaging	Bulk
Other Names	3M5577 5111990514 51119905144 80001202581 CP2HC055GE1TG30
Operating Temperature	-55°C ~ 125°C
Number of Rows	5 + 2
Number of Positions Loaded	All
Number of Positions	77 (55 + 22 Ground)
Mounting Type	Through Hole
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Part Number	CP2-HC055-GE1-TG30
Features	Board Guide
Expanded Description	77 (55 + 22 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole
Description	CONN HEADER TYP-C 55POS VERT AU
Current Rating	-
Contact Finish Thickness	30µin (0.76µm)
Contact Finish	Gold
Connector Usage	CompactPCI
Connector Type	Header, Male Pins
Connector Style	C 11

Others

Other Names	3M5577 5111990514 51119905144 80001202581 CP2HC055GE1TG30
Standard Package	810

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	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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