EXSHINE Part Number: | EX-FP-301-1/4-CLEAR-6"-PACK |
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Manufacturer Part Number: | FP-301-1/4-CLEAR-6"-PACK |
Manufacturer / Brand: | 3M |
Brief Description: | HEATSHRINK FP301 1/4-6" CLEAR |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | Heat Shrink Tubing and Devices CatalogHeat Shrink Tubing Selection GuideHeat Shrink Product CatalogFP-301 Series Datasheet |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Values | 10 - 26 pc Pkgs - 6" (152.4mm) lengths |
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Shrinkage Ratio | 2 to 1 |
Series | FP-301 |
Packaging | Refill Pack |
Other Names | 00051135364956 05113536495 80610784029 FP301-1/4-CLEAR-6"-PACK |
Manufacturer Standard Lead Time | 8 Weeks |
Manufacturer Part Number | FP-301-1/4-CLEAR-6"-PACK |
Expanded Description | Heat Shrink Kit 10 - 26 pc Pkgs - 6" (152.4mm) lengths 2 to 1 Clear |
Diameter | 1/4" |
Description | HEATSHRINK FP301 1/4-6" CLEAR |
Color | Clear |
Standard Package | 10 |
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Other Names | 00051135364956 05113536495 80610784029 FP301-1/4-CLEAR-6"-PACK |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.