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HM-H110APWR1-5CP1-TG30

EXSHINE Part Number:EX-HM-H110APWR1-5CP1-TG30
Manufacturer Part Number:HM-H110APWR1-5CP1-TG30
Manufacturer / Brand:3M
Brief Description:CONN HEADER HSHM 110POS 5ROW STR
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HM-H110APWR1-5CP1-TG30
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HM-H110APWR1-5CP1-TG30
In stock: 13150 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HM-H110APWR1-5CP1-TG30 online

US$ 28.197

Reference Marketing Price: US$ 28.197

Our Best Price: N/A (Email us)

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Multiples:1

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$28.197
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Product Parameter

Voltage Rating -
Termination Press-Fit
Series MetPak™ HM
Pitch 0.079" (2.00mm)
Packaging Bulk
Other Names 00051115586293
05111558629
5111558629
51115586293
70010024043
Operating Temperature -55°C ~ 125°C
Number of Rows 5
Number of Positions Loaded All
Number of Positions 114 (110 + 4 Power)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 13 Weeks
Manufacturer Part Number HM-H110APWR1-5CP1-TG30
Features -
Expanded Description 114 (110 + 4 Power) Position Header, Male Pins and Blades Connector 0.079" (2.00mm) Through Hole
Description CONN HEADER HSHM 110POS 5ROW STR
Current Rating 1A
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Usage -
Connector Type Header, Male Pins and Blades
Connector Style A 22

Others

Standard Package 840
Other Names 00051115586293

05111558629

5111558629

51115586293

70010024043

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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