HM-S176DPWR1-8AP1-TG30

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HM-S176DPWR1-8AP1-TG30

EXSHINE Part Number:EX-HM-S176DPWR1-8AP1-TG30
Manufacturer Part Number:HM-S176DPWR1-8AP1-TG30
Manufacturer / Brand:3M
Brief Description:HM PRESS-FIT POWER SOCKET R/A
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HM Series MetPak Socket
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HM-S176DPWR1-8AP1-TG30
In stock: 18600 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HM-S176DPWR1-8AP1-TG30 online

US$ 37.894

Reference Marketing Price: US$ 37.894

Our Best Price: N/A (Email us)

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Multiples:1

160+:
$37.894
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Product Parameter

Voltage Rating -
Termination Press-Fit
Series MetPak™ HM
Pitch 0.079" (2.00mm)
Packaging Bulk
Other Names 0-00-51111-53387-1
5111153387
51111533871
70010023276
70010026014
80400012656
HMS176DPWR18AP1TG30
Operating Temperature -55°C ~ 125°C
Number of Rows 8
Number of Positions Loaded All
Number of Positions 180 (176 + 4 Power)
Mounting Type Through Hole, Right Angle
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 12 Weeks
Manufacturer Part Number HM-S176DPWR1-8AP1-TG30
Features Mating Guide
Expanded Description 180 (176 + 4 Power) Position Receptacle, Female Sockets and Blade Sockets Connector 0.079" (2.00mm) Through Hole, Right Angle
Description HM PRESS-FIT POWER SOCKET R/A
Current Rating 1A
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Usage -
Connector Type Receptacle, Female Sockets and Blade Sockets
Connector Style D 22

Others

Other Names 0-00-51111-53387-1

5111153387

51111533871

70010023276

70010026014

80400012656

HMS176DPWR18AP1TG30
Standard Package 80

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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