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HSHM-H055CR5-5CP1-TG30L

EXSHINE Part Number:EX-HSHM-H055CR5-5CP1-TG30L
Manufacturer Part Number:HSHM-H055CR5-5CP1-TG30L
Manufacturer / Brand:3M
Brief Description:CONN HEADER HSHM 55POS 5ROW STR
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HSHM Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HSHM-H055CR5-5CP1-TG30L
In stock: 16420 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HSHM-H055CR5-5CP1-TG30L online

US$ 26.448

Reference Marketing Price: US$ 26.448

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

100+:
$26.448
  • Description
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Product Parameter

Voltage Rating -
Termination Press-Fit
Series MetPak™ HSHM
Pitch 0.079" (2.00mm)
Packaging Bulk
Other Names 00051115578519
05111557851
5111557851
51115578519
80001253188
Operating Temperature -55°C ~ 125°C
Number of Rows 5
Number of Positions Loaded All
Number of Positions 55
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 13 Weeks
Manufacturer Part Number HSHM-H055CR5-5CP1-TG30L
Features Board Guide, Shielded
Expanded Description 55 Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole
Description CONN HEADER HSHM 55POS 5ROW STR
Current Rating 1A
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Usage Backplane
Connector Type Header, Male Pins
Connector Style CR 11

Others

Standard Package 100
Other Names 00051115578519

05111557851

5111557851

51115578519

80001253188

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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