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Home > Products > Cables, Wires - Management > Heat Shrink Tubing > ITCSN-1100-9"-BLACK-100 PCS
ITCSN-1100-9

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ITCSN-1100-9"-BLACK-100 PCS

EXSHINE Part Number:EX-ITCSN-1100-9"-BLACK-100 PCS
Manufacturer Part Number:ITCSN-1100-9"-BLACK-100 PCS
Manufacturer / Brand:3M
Brief Description:HEATSHRK ITCSN ADH 1.1"X9" BLK
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:ITCSN Series Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
ITCSN-1100-9"-BLACK-100 PCS
In stock: 78400 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order ITCSN-1100-9"-BLACK-100 PCS online

US$ 5.981

Reference Marketing Price: US$ 5.981

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

100+:
$5.981
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  • Description
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Product Parameter

Type Tubing, Semi Rigid
Shrinkage Ratio 3 to 1
Shrink Temperature 121°C
Series ITCSN
Recovered Wall Thickness -
Other Names 00054007089704
05400708970
80008007249
Operating Temperature -55°C ~ 110°C
Material Polyolefin (PO), Irradiated
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number ITCSN-1100-9"-BLACK-100 PCS
Length 0.750' (228.60mm, 9.00")
Inner Diameter - Supplied 1.100" (27.94mm)
Inner Diameter - Recovered 0.370" (9.40mm)
Features Adhesive Lined, Split Resistant, UV Resistant, Weather Resistant
Expanded Description Heat Shrink Tubing, Semi Rigid 1.100" (27.94mm) 3 to 1 Black 0.750' (228.60mm, 9.00")
Description HEATSHRK ITCSN ADH 1.1"X9" BLK
Color Black

Others

Standard Package 100
Other Names 00054007089704

05400708970

80008007249

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 Delivery time: 1-3 days.
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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